77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
PCB Manufacturing · Standard & Advanced PCB
Rigid-Flex PCB
Combined rigid and flexible circuits that replace connectors and cables in compact, three-dimensional assemblies.
Standard & Advanced PCB
Rigid-Flex PCB with ShinePCB
Rigid-flex boards join rigid sections with flexible layers in one construction. We review bend areas, transitions, stiffeners and assembly constraints against your drawing so the design works both in production and in the product.
- Rigid and flexible layer construction
- Bend areas and transition zones
- Coverlay and stiffener placement
- Assembly and handling constraints
Capability and certificates
| Positioning | Rigid + Flexible | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Rigid-Flex PCB | 20L | 18L |
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Rigid-flex capability
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 20L | 18L |
| Panel size | 400 × 540 mm | 400 × 540 mm |
| Finished board thickness | 0.25–5.0 mm | 0.25–3.2 mm |
| Min trace / space | 1.5 / 1.5 mil | 2 / 2 mil |
| Min hole-to-trace clearance | 4 mil | 5 mil |
| Copper weight | 1/3–3 oz | 1/3–2 oz |
| Layer registration accuracy | 0.8 mil | 1 mil |
| Min through-hole diameter | 0.075 mm | 0.10 mm |
| Min laser via diameter | 0.05 mm | 0.05 mm |
| Max aspect ratio | 16:1 | 12:1 |
| Etching tolerance | ±10% / ±0.8 mil | ±10% / ±1 mil |
| Min solder mask bridge | 2 mil | 3 mil |
| Impedance control tolerance | ±5% | ±7% |
| Surface finish | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon | ENIG, hard gold, immersion tin, immersion silver, OSP |
| Supported structures | Single-sided core, symmetrical and asymmetrical stack-ups, multilayer, gold finger, air gap, HDI, build-up, bookbinder, high-speed design | Same structures as prototype |
| Material types | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Same material families as prototype |
Source: ShinePCB capability workbook, 2025 values. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 12 | 16 |
| Min dielectric thickness | 12.5 µm | 12.5 µm |
| Min BGA pitch | 150 µm | 100 µm |
| Min board thickness | 50 µm | 50 µm |
| Max panel size | 610 × 1200 mm | 610 × 1200 mm |
| Base copper thickness | 9–35 µm | 6–35 µm |
| Min trace / space | 40 / 40 µm | 35 / 35 µm |
| Pattern registration tolerance | ±50 µm | ±20 µm |
| Min pattern-to-edge clearance | 0.10 mm | 0.07 mm |
| Etching tolerance | ±20 µm | ±15 µm |
| Min through-hole diameter | 0.10 mm | 0.075 mm |
| Min blind via diameter | 0.05 mm | 0.05 mm |
| Hole diameter tolerance | ±0.05 mm | ±0.05 mm |
| Impedance control tolerance | ±10% | ±5% |
| Outline tolerance | ±0.10 mm | ±0.05 mm |
| Surface finish | HASL, ENIG, immersion silver, OSP, ENEPIG, hard gold | HASL, ENIG, immersion silver, OSP, ENEPIG, hard gold |
| Stiffener type | FR-4, PI, stainless steel | FR-4, PI, stainless steel |
| Stiffener registration tolerance | ±0.20 mm | ±0.10 mm |
| HDI capability | 4-layer any-layer interconnect | 6-layer any-layer interconnect |
| LCP material | Supported | Supported |
Source: ShinePCB capability workbook (FPC sheet has no year column). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
Selected builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical applications
Medical and wearable devices
Cameras and optical modules
Aerospace-style and ruggedised assemblies
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Rigid-Flex PCB FAQs
What should my drawing show?
Mark the rigid and flexible areas, bend locations and any stiffeners, together with the layer construction.
Can rigid-flex boards be assembled with components?
Yes. Assembly needs are reviewed with the construction so the board can be supported during assembly.
